Advanced Packaging Reliability Engineer at OpenAI
- Company: OpenAI
- Location: Remote / San Francisco
- Employment type: Full-time
- Salary: $266K – $445K • Offers Equity
- Posted: 2026-06-16
- Technologies: OpenAI
About the role
ABOUT THE TEAM: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. ROLE OVERVIEW We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes.…
Apply on OpenAI's official careers page: https://jobs.ashbyhq.com/openai/6d545b2c-5697-4f38-affc-aaa309f5bb26